Semiconductor apparatus including a heat dissipating member

A semiconductor apparatus comprising:

• a base having a main surface on which a terminal is disposed;
• a heat dissipating member disposed on the main surface of the base, in a region excluding the terminal;
• a first semiconductor device retained on the heat dissipating member and having a top surface on which an electrode is disposed;
• a connection member connecting the terminal and the electrode, the connection member having a peak portion which is the portion of the connection member located the farthest away from the base when viewed in plan;
• an encapsulant disposed on the main surface of the base and covering the terminal, the first semiconductor device and the connection member,
• wherein,
• the heat dissipating member has an H-shape in a plan view and includes a first block, a second block, and a third block,
• the first block and the second block cover a region above the base excluding (i) above the first semiconductor device and (ii) above a region in which the connection member is disposed,
• the third block connects the first block and the second block together, and
• the first block and the second block of the heat dissipating member have top surfaces that are farther than the peak portion of the connection member from the base.