Chip-embedded packages with backside die connection

A semiconductor package, comprising:

• a semiconductor die embedded in an insulating material, the die having opposing first and second surfaces and an edge extending between the first and second surfaces;
• a structured metal redistribution layer disposed in the insulating material below the die;
• first conductive vias connecting the structured metal redistribution layer to terminals at the first surface of the die;
• a first metal component embedded in the insulating material above the die and bonded to the second surface of the die, part of the first metal component extending laterally beyond the edge of the die;
• second conductive vias extending vertically from the structured metal redistribution layer toward the first metal component and terminating prior to the first metal component so that a gap exists between the second conductive vias and the part of the first metal component extending laterally beyond the edge of the die;
• and
• a second metal component disposed in the gap and connecting the second conductive vias to the part of the first metal component extending laterally beyond the edge of the die.

A semiconductor package, comprising:

• a semiconductor die embedded in an insulating material, the die having opposing first and second surfaces and an edge extending between the first and second surfaces;
• a structured metal redistribution layer disposed in the insulating material below the die;
• a first metal component embedded in the insulating material above the die and bonded to the second surface of the die, part of the first metal component extending laterally beyond the edge of the die;
• and
• a second metal component disposed under and connected to the part of the first metal component that extends laterally beyond the edge of the die, the second metal component vertically extending through the insulating material so that part of the second metal component is uncovered by the insulating material at a side of the package facing away from the second surface of the die,
• wherein the first and second metal components form at least a thermal pathway from the second surface of the die to the side of the package facing away from the second surface of the die.