Heat spreading layer with high thermal conductivity

A cooling system for a semiconductor package comprising:

• a heat spreading layer comprised of graphite partially encased in a supporting frame comprised of copper and wherein the heat spreading layer is affixed to the supporting frame with an adhesive layer, the heat spreading layer including a perimeter, the supporting frame being configured to encase the perimeter and an adjacent portion of the heat spreading layer, defining centrally exposed top and bottom portions of the heat spreading layer;
• and
• a chip die thermally connected to the centrally exposed bottom portion of the heat spreading layer by a first thermal interface material, and further comprising a heat dissipating element thermally connected to a top surface of the heat spreading layer by a second thermal interface material, the heat dissipating element having a centrally protruding portion on a bottom surface thereof, wherein the centrally protruding portion is beveled.