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US 9,437,509 B2Granted
Package for electronic components suppressing multipactor discharge
AssigneeSumitomo Electric Device Innovations, Inc.
InventorsKen Osawa, Harutoshi Saigusa
Life of this patent
Estimating the term…
Abstract
A package for electronic components that suppresses multipactor discharge is disclosed. The package includes a metal base and a casing. The metal base provides a pocket in the side thereof. The casing, mounted on the metal base to surround electronic components therein, provides a lead terminal connecting the electronic components to the outside and a feedthrough to isolate the lead terminal from the metal base. The pocket in the metal base is positioned beneath the lead terminal with an insulator therebetween.
Claims13
A package for enclosing electronic components, comprising:
- an electrically conductive base having a top surface that mounts the electronic components thereon;
- a casing provided on the top surface of the base, the casing surrounding the electronic components therein;
- and
- a feedthrough including an insulator and a conductive pattern formed on the insulator, the feedthrough passing through the casing,
- wherein the base provides a pocket cut from an edge thereof the pocket being positioned beneath the feedthrough.
2 more elements
Dependencies are inferred from the claim text.