Method for manufacturing semiconductor device and semiconductor device

A method for manufacturing a semiconductor device including a plurality of packages disposed in a resin-molded case, the package containing a power semiconductor element,

• the method comprising:
• placing a bottom of the case on a working table with an opening formed at the bottom, the case including a first terminal with one end internally drawn along the bottom of the case for connecting to the power semiconductor element;
• placing the package on the working table through the opening of the case, the package including a second terminal connected to the power semiconductor element, disposing a first faying surface that is a top surface of the first terminal of the case and a second faying surface that is an undersurface of the second terminal of the package in such a manner that the first faying surface and the second faying surface are opposed to each other, and forming a clearance between the first faying surface and the second faying surface;
• and
• electrically connecting the first terminal and the second terminal with a bonding material disposed in the clearance.