Semiconductor device and manufacturing method thereof

A semiconductor device, comprising:

• a substrate including a surface;
• and
• a plurality of pads disposing on the surface of the substrate,
• wherein the plurality of pads includes a first type pad and a second type pad, the first type pad is contacting a via located underlying the first type pad and within a projection area of the first type pad, and the second type pad is contacting an underlying isolation within a projection area of the second type pad, wherein the second type pad is laterally connected with a conductive trace, and the conductive trace connects to another via that is at a same level with the via, and the semiconductor device further comprises:
• a conductive bump on the second type pad, wherein the conductive bump further connects to a conductive feature of a semiconductor die external to the substrate.