Semiconductor device and method of forming shielding layer over active surface of semiconductor die

A semiconductor device, comprising:

• a semiconductor die including an opening formed in an active surface of the semiconductor die and extending from the active surface of the semiconductor die through the semiconductor die to reach a second surface of the semiconductor die opposite the active surface;
• and
• a conductive layer formed over the active surface of the semiconductor die and extending over a side surface of the semiconductor die and into the opening to operate as a shielding layer over the semiconductor die.

A semiconductor device, comprising:

• a semiconductor die including an opening in an active surface of the semiconductor die;
• and
• a shielding layer formed over the active surface of the semiconductor die and a side surface of the semiconductor die with the shielding layer extending into the opening in the active surface of the semiconductor die, wherein the opening extends from the active surface of the semiconductor die completely through the semiconductor die to a second surface of the semiconductor die opposite the active surface.

A semiconductor device, comprising:

• a semiconductor die including an opening in an active surface of the semiconductor die;
• and
• a shielding layer formed over the active surface of the semiconductor die and a side surface of the semiconductor die with the shielding layer extending into the opening in the active surface of the semiconductor die, wherein the shielding layer is electrically isolated from the active surface of the semiconductor die.