Chip package and method for forming the same

A method for forming a chip package, comprising:

• providing a chip including a semiconductor substrate, wherein the chip comprises:
• a sensing region or device region adjacent to an upper surface of the chip;
• and
• a sensing array in the sensing region or device region and comprising a plurality of sensing units that measure changes to external physical quantities;
• forming a plurality of first openings in the chip to correspondingly expose the plurality of sensing units;
• and
• forming a plurality of conductive extending portions in the plurality of first openings to electrically connect to the plurality of sensing units, wherein the plurality of conductive extending portions extends from the plurality of first openings onto the upper surface of the chip.