Method for manufacturing semiconductor device

A method for manufacturing a semiconductor device, comprising the steps of:

• mounting a semiconductor chip and a cylindrical electrode on one main surface of a substrate, said cylindrical electrode including a side wall portion, a lower end, and an upper end, said upper end including an annular portion axially corresponding to said side wall portion and a transverse portion extending radially across said annular portion above a cavity formed in said cylindrical electrode, said transverse portion having a first axial thickness in a cavity cutout region directly above said cavity and a second axial thickness in another region directly above said cavity, wherein said first axial thickness is thinner than said second axial thickness;
• sealing said substrate, said semiconductor chip, and said cylindrical electrode with resin material such that said lower end of said cylindrical electrode is mounted to said substrate and said upper end of said cylindrical electrode is exposed;
• and
• forming an opening extending through said transverse portion of said upper end of said cylindrical electrode to said cavity in said cylindrical electrode after said step of sealing,
• before performing said step of forming an opening, said upper end of said cylindrical electrode is closed by said transverse portion of said upper end.