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US 9,437,459 B2Granted
Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure
AssigneeFreescale Semiconductor, Inc.
InventorsBurton J. Carpenter, Chu-Chung Lee, Tu-Anh N. Tran
Life of this patent
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Abstract
An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.
Claims13
A method comprising:
- attaching an electronic component to a package substrate, the package substrate includes an aluminum clad copper structure having an aluminum bond pad surface, the aluminum clad copper structure is attached to a dielectric layer of the package substrate;
- electrically coupling a conductive structure of the electronic component to the aluminum bond pad surface;
- encapsulating the electronic component and at least a portion of the package substrate with an encapsulant, the at least a portion including the aluminum bond pad surface;
- wherein the aluminum clad copper structure is formed by attaching an aluminum clad copper layer to the dielectric layer and subsequently removing material of the aluminum clad copper layer.
1 more element
Dependencies are inferred from the claim text.