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US 9,437,446 B2Granted
Slurry for chemical mechanical polishing and chemical mechanical polishing method
AssigneeKuraray Co., Ltd.
InventorsMitsuru Kato, Chihiro Okamoto, Shinya Kato
Life of this patent
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Abstract
The present invention provides a slurry for chemical mechanical polishing, containing abrasive grain (a), compound (b) having an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and water.
Claims15
A slurry for chemical mechanical polishing, comprising
- abrasive grain (a),
- compound (b) comprising an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and
- water.
Dependencies are inferred from the claim text.