Self-compensating oxide layer
AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorsHelen L. Maynard, Deven Raj Mittal, Jun Seok Lee
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AssigneeVarian Semiconductor Equipment Associates, Inc.
InventorsHelen L. Maynard, Deven Raj Mittal, Jun Seok Lee
Estimating the term…
A method of conformally doping a device on a semiconductor workpiece is disclosed. An oxide layer is applied to all surfaces of the device. Further, the thickness of the oxide layer on each surface is proportional to the energy that ions impact that particular surface. For example, ions strike the horizontal surfaces at nearly a normal angle and penetrate more deeply into the workpiece than ions striking the vertical surfaces. After creating an oxide layer that has a variable thickness, a subsequent dopant implant is performed. While ions strike the horizontal surfaces with more energy, these ions pass through a thicker oxide layer to penetrate the workpiece. In contrast, ions strike the vertical surfaces with less energy, but traverse a much thinner oxide layer to penetrate the workpiece. The result is a conformally doped device.
A method of doping a workpiece having at least two surfaces of different orientations, comprising:
A method of doping a workpiece, comprising:
A method of creating a conformally doped structure on a workpiece, comprising:
Dependencies are inferred from the claim text.