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US 9,437,405 B2Granted
Hot rolled plate made of copper alloy used for a sputtering target and sputtering target
AssigneeMitsubishi Materials Corporation
InventorsKiyoyuki Okubo, Masato Koide
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Abstract
Disclosed is a hot rolled plate produced by hot rolling an ingot cast by continuous casting, in which the plate is made of a copper alloy containing 0.5 to 10.0 at % of Ca and the balance consisting of Cu and inevitable impurities and the average grain size of Cu-α phase crystal grains is 5 to 60 μm in a Cu matrix.
Claims8
A hot rolled plate for a sputtering target, said hot rolled plate comprising:
- a copper alloy, wherein
- the copper alloy contains 0.5 to 10.0 at % of Ca and the balance consisting of Cu and inevitable impurities,
- an average grain size of Cu-α phase crystal grains is 5 to 60 μm in a Cu matrix, and
- Cu—Ca-based crystals are dispersed in the Cu matrix.
1 more element
Dependencies are inferred from the claim text.