Insulated dielectric window assembly of an inductively coupled plasma processing apparatus
AssigneeLam Research Corporation
InventorsDavid Setton, Gautam Bhattacharyya, Brett C. Richardson
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Abstract
An insulated dielectric window assembly comprising a dielectric window of an inductively coupled plasma processing apparatus; an upper polymeric ring, and a lower polymeric ring. The upper polymeric ring insulates the outer edge of the dielectric window from a cooler ambient atmosphere and the lower polymeric ring insulates the lower surface of the dielectric window from a chamber surface supporting the window.
Claims24
An insulated dielectric window assembly for use as an upper wall of an inductively coupled plasma processing chamber in which semiconductor substrates can be processed, the insulated dielectric window assembly comprising:
- a dielectric window including a central bore extending between upper and lower surfaces configured to receive a top gas injector and at least one blind bore in the upper surface configured to receive a temperature monitoring sensor;
- an upper polymeric ring of a thermally insulating material on an outer exposed section of the dielectric window, the upper polymeric ring including a cylindrical side wall and an annular upper wall extending radially inward from an upper end of the cylindrical side wall, the cylindrical side wall on a side surface of the dielectric window and the annular upper wall on an outer portion of the upper surface of the dielectric window so as to provide a thermal barrier from a surrounding ambient atmosphere;
- and
- a lower polymeric ring wherein a lower surface of the dielectric window is positioned on an upper surface of the lower polymeric ring so as to provide a thermal barrier between the dielectric window and a support surface of the plasma processing chamber.
An upper polymeric ring for use as a thermal barrier on an outer edge of a dielectric window of an insulated dielectric window assembly of an inductively coupled plasma processing chamber in which semiconductor substrates can be processed, the upper polymeric ring comprising:
- a thermally insulating material configured to fit on an outer exposed section of the dielectric window,
- the upper polymeric ring including a cylindrical side wall and an upper annular wall extending radially inward from an upper end of the cylindrical side wall, the cylindrical side wall configured to be on a side surface of the dielectric window and the annular upper wall configured to be on an outer portion of the upper surface of the dielectric window so as to provide a thermal barrier from a surrounding ambient atmosphere, wherein the cylindrical side wall includes four lower cutouts circumferentially spaced apart and extending into a lower end thereof and the annular upper wall includes four upper cutouts circumferentially spaced apart and extending radially from an inner edge to an outer edge of the annular upper wall.
Dependencies are inferred from the claim text.