Method of manufacturing a winding-type solid electrolytic capacitor package structure without using a lead frame

A method of manufacturing a winding-type solid electrolytic capacitor package structure without using a lead frame, comprising:

• providing at least one winding capacitor, wherein the at least one winding capacitor has a winding body, a positive conductive lead pin extended from a first lateral side of the winding body, and a negative conductive lead pin extended from a second lateral side of the winding body;
• forming a package body to enclose the winding body, wherein the positive conductive lead pin has a first embedded portion enclosed by the package body and a first exposed portion connected with the first embedded portion and exposed outside the package body, and the negative conductive lead pin has a second embedded portion enclosed by the package body and a second exposed portion connected with the second embedded portion and exposed outside the package body;
• and bent the first exposed portion and the second exposed portion along an outer surface of the package body;
• wherein the positive conductive lead in has a first positive conductive portion, a second positive conductive portion, and a first soldering portion connected between the first positive conductive portion and the second positive conductive portion, the second positive conductive portion is a first multilayer structure composed of a plurality of first material layers, and the negative conductive lead in is a second multilayer structure composed of a plurality of second material layers.