Semiconductor device connected by anisotropic conductive adhesive film
AssigneeCheil Industries Inc.
InventorsKyoung Hun Shin, Do Hyun Park, Hyun Joo Seo, Young Ju Shin, Kyu Bong Kim, Woo Jun Lim
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AssigneeCheil Industries Inc.
InventorsKyoung Hun Shin, Do Hyun Park, Hyun Joo Seo, Young Ju Shin, Kyu Bong Kim, Woo Jun Lim
Estimating the term…
A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.
A display device connected using an anisotropic conductive adhesive film, the anisotropic conductive adhesive film comprising:
A display device, comprising:
Dependencies are inferred from the claim text.