Unipolar programmable metallization cell
AssigneeMacronix International Co., Ltd.
InventorsFeng-Ming Lee, Yu-Yu Lin, Ming-Hsiu Lee
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AssigneeMacronix International Co., Ltd.
InventorsFeng-Ming Lee, Yu-Yu Lin, Ming-Hsiu Lee
Estimating the term…
A programmable metallization device comprises a first electrode and a second electrode, and a dielectric layer, a conductive ion-barrier layer, and an ion-supplying layer in series between the first and second electrodes. In operation, a conductive bridge is formed or destructed in the dielectric layer to represent a data value using bias voltages having the same polarity, enabling the use of diode access devices. To form a conductive bridge, a bias is applied that is high enough to cause ions to penetrate the conductive ion-barrier layer into the dielectric layer, which then form filaments or bridges. To destruct the conductive bridge, a bias of the same polarity is applied that causes current to flow through the structure, while ion flow is blocked by the conductive ion-barrier layer. As a result of Joule heating, any bridge in the dielectric layer disintegrates.
A memory device, comprising a programmable metallization cell including:
The memory device of 1, wherein the conductive ion-barrier layer comprises a material to block ion diffusion from the ion-supplying layer to the dielectric layer during the second bias condition, while allowing sufficient ion diffusion from the ion-supplying layer to the dielectric layer for formation of conductive bridges during the first bias condition.
An integrated circuit, comprising:
Dependencies are inferred from the claim text.