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US 9,436,902 B1Granted
RFID integrated circuits with large contact pads
AssigneeImpinj, International Ltd.
InventorsRonald Lee Koepp, Tan Mau Wu, Ronald A. Oliver, Harley Heinrich, Jaideep Mavoori, Christopher J. Diorio
Life of this patent
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Abstract
An RFID IC assembly having a repassivation layer and a conductive redistribution layer may be assembled onto a tag substrate with an additional layer. The additional layer includes one or more etchants for creating an opening in a nonconductive barrier layer between the assembly and the substrate, and may also include an adhesive for attaching the assembly to the substrate.
Claims14
A Radio Frequency Identification (RFID) tag precursor comprising:
- an assembly including an RFID integrated circuit (IC), a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface, in which at least a first portion of the redistribution layer is electrically connected to the IC through a first opening in the repassivation layer,
- a substrate including a first antenna terminal;
- a second opening, formed by an etchant, in a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer, and
- an adhesive attaching the assembly to the substrate;
- wherein
- a first electrical connection is formed between the first antenna terminal and the first portion of the redistribution layer through the second opening;
- and
- the first opening and the second opening are nonoverlapping.
5 more elements
A Radio Frequency Identification (RFID) tag precursor comprising:
- an assembly including an RFID integrated circuit (IC) with an IC contact, a nonconductive repassivation layer on a surface of the IC and confined within a perimeter of the surface, and a conductive redistribution layer on the repassivation layer and confined within the perimeter of the surface;
- a substrate including a first antenna terminal;
- an adhesive attaching the assembly to the substrate;
- a first electrical connection between a first portion of the redistribution layer and the IC contact;
- an opening, formed by an etchant, in a nonconductive barrier present on at least one of the first antenna terminal and the first portion of the redistribution layer;
- and
- a second electrical connection formed between the first antenna terminal and the first portion of the redistribution layer through the opening.
4 more elements
Dependencies are inferred from the claim text.