Cooling device for electronic device

A cooling device for an electronic device, the cooling device comprising:

• a back portion including a first outer surface and a first inner surface, the first inner surface including a plurality of projections for coupling to a back side of the electronic device when the cooling device is coupled to the electronic device;
• and
• side walls extending about at least a portion of the periphery of the back portion and from the first inner surface thereof including a second outer surface and a second inner surface for coupling to side surfaces of the electronic device when the cooling device is coupled to the electronic device, the side walls including a plurality of cooling apertures extending from the second inner surface to the second outer surface and a recessed cooling channel in the second inner surface extending from each cooling aperture at least to the back portion, and
• wherein when the cooling device is coupled to the electronic device, the plurality of projections, the cooling channels and the back side of the electronic device form a plurality of cooling pathways extending between the plurality of cooling apertures and along at least a portion of the back side of the electronic device.