Convection-cooled electronic system

A method for promoting airflow cooling in a system comprising an electronic device and a stand, the electronic device having a device housing with a lower device housing portion and an upper device housing portion, the stand having a stand housing with a periphery and a base, the stand housing having a slot extending across the periphery, the slot having a shape corresponding to a shape of the lower device housing portion and configured to receive the lower device housing portion, the method comprising:

• one or more electronic components emitting thermal energy, the one or more electronic components mounted in an interior of the device housing between the lower device housing portion and the upper device housing portion;
• convectionally intaking air into the stand housing through a plurality of stand air intake openings distributed about the periphery between an exterior of the stand housing and an interior of the stand housing;
• convectionally communicating the air from a plurality of stand air intake openings to a plurality of device air intake openings in the lower device housing portion, the lower device housing portion extending into the slot;
• convectionally communicating the air past the one or more electronic components;
• and
• convectionally exhausting the air through a plurality of device air exhaust openings in the upper device housing portion.