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US 9,436,235 B2Granted
Heat sink with an integrated vapor chamber
AssigneeNVIDIA Corporation
InventorsSrinivasa Rao Damaraju, Joseph Walters, Dalton Seth O'Connor
Life of this patent
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Abstract
A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.
Claims16
A heat sink comprising:
- an upper portion having a plurality of fins formed therein;
- and
- a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion,
- wherein the vapor chamber comprises an interior volume of at least one of the fins in the plurality of fins,
- wherein a bottom surface of the base portion contacts a processor such that heat generated by the processor is transferred through the base portion to a pool of liquid contained within the vapor chamber.
2 more elements
A system, comprising:
- a processor;
- and
- a heat sink comprising:
- an upper portion having a plurality of fins formed therein, and
- a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion,
- wherein the vapor chamber comprises an interior volume of at least one of the fins in the plurality of fins,
- wherein a bottom surface of the base portion contacts the processor such that heat generated by the processor is transferred through the base portion to a pool of liquid contained within the vapor chamber.
4 more elements
Dependencies are inferred from the claim text.