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US 9,436,077 B2Granted
Method of fabricating a pellicle frame
AssigneesSamsung Electronics Co., Ltd., Fine Semitech Corp.
InventorsJeong jin Kim, Bum hyun An, Chan uk Jeon, Han shin Lee, Jae hyuck Choi, Seung wan Kim, Ik jun Kim, Jang dong You
Life of this patent
Estimating the term…
Abstract
A pellicle frame, including aluminum, aluminum oxide, and a transition metal.
Claims6
A method of fabricating a lithography apparatus, the method comprising:
- preparing a main body of a pellicle frame that includes a first material layer including aluminum, the first material layer having a vent hole;
- forming a second material layer on a surface of the first material layer of the pellicle frame using a wet process using wet oxidation plasma, the second material layer including aluminum oxide and a transition metal, the second material layer being formed on the first material layer such that the first material layer is completely enclosed by the second material layer excepting a sidewall of the vent hole;
- and
- attaching a pellicle membrane to the pellicle frame having the second material layer with an adhesive layer interposed between the second material layer and the pellicle membrane.
1 more element
Dependencies are inferred from the claim text.