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US 9,436,065 B2Granted
High-strength titanium copper foil and method for producing same
AssigneeJX Nippon Mining & Metals Corporation
InventorMasayuki Nagano
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AssigneeJX Nippon Mining & Metals Corporation
InventorMasayuki Nagano
Estimating the term…
To provide a high-strength titanium-copper foil that is more suitable as a conductive spring material that can be used in electronic device components such as an autofocus camera module. A titanium copper foil containing Ti in an amount of 2.0 to 4.0 mass %, a remainder being copper and unavoidable impurities, said foil having a 0.2% yield strength of 1000 MPa or more and a spring limit value of 800 MPa or more in both directions parallel and perpendicular to a rolling direction, wherein no cracking occurs at bending radius/foil thickness=2 when a W bending test in conformity with JIS H3130: 2012 is performed at a width of 0.5 mm in a direction perpendicular to the rolling direction.
A titanium copper foil containing Ti in an amount of 2.0 mass% to 4.0 mass%, optionally containing one or more elements selected from the group consisting of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of 0 mass% to 1.0 mass%, a remainder being copper and unavoidable impurities, said foil having a 0.2% yield strength of 1000 MPa or more in both directions parallel and perpendicular to a rolling direction, and a spring limit value of 800 MPa or more in both directions parallel and perpendicular to the rolling direction, wherein no cracking occurs at bending radius/foil thickness =2 when a W bending test in conformity with JIS H3130:
Dependencies are inferred from the claim text.