Optical connection techniques and configurations

A method, comprising:

• depositing solder interconnect material to facilitate attachment of components to a surface of a package substrate;
• positioning the components for attachment to the package substrate, the components including at least an optoelectronic assembly configured to emit and/or receive optical signals in a form of light, and a receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned to route the light when the optical coupler plug is plugged into the receptacle, wherein positioning the components includes positioning the receptacle and the optoelectronic assembly such that they do not physically contact one another;
• and
• reflowing the deposited solder interconnect material to form a bond between the components and the package substrate, wherein reflowing the deposited solder interconnect material results in solder self-alignment of the receptacle and optoelectronic assembly relative to the package substrate to provide optical alignment between one or more optical apertures of the optoelectronic assembly and the optical coupler plug when the optical coupler plug is plugged into the pluggable surface of the receptacle.

A method, comprising:

• depositing solder interconnect material to facilitate attachment of components to a surface of a package substrate;
• positioning the components for attachment to the package substrate, the components including at least an optoelectronic assembly configured to emit and/or receive optical signals in a form of light, and a receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned to route the light when the optical coupler plug is plugged into the receptacle, wherein positioning the components includes positioning the receptacle and the optoelectronic assembly such that they do not physically contact one another, wherein positioning the components includes positioning the optoelectronic assembly and the receptacle adjacent to a terminating edge of the package substrate, the receptacle having a U-shape and substantially surrounding the optoelectronic assembly;
• and
• reflowing the deposited solder interconnect material to form a bond between the components and the package substrate.

A method, comprising:

• depositing solder interconnect material to facilitate attachment of components to a surface of a package substrate;
• positioning the components for attachment to the package substrate, the components including at least an optoelectronic assembly configured to emit and/or receive optical signals in a form of light, and a receptacle having a pluggable surface to receive an optical coupler plug such that the optical coupler plug is optically aligned to route the light when the optical coupler plug is plugged into the receptacle;
• reflowing the deposited solder interconnect material to form a bond between the components and the package substrate;
• performing a cleaning process to clean the package substrate and the components;
• depositing an underfill material to fill a region between the components and the package substrate;
• and
• forming an integrated heat spreader that is coupled to the optoelectronic assembly and a processor to remove heat from the optoelectronic assembly and the processor when in operation.