Socket device for an IC test

A socket device for IC tests, the socket device comprising:

• a socket body including
• an upper plate having
• first through holes,
• movement guide holes formed in a central portion of the upper plate, and
• stop protrusions formed to protrude toward lateral directions of the upper plate,
• a lower plate coupled to a bottom side of the upper plate and having second through holes formed in a position corresponding to the first through holes, and
• spring contacts, each of the spring contacts being inserted into corresponding one pair of the first and second through holes;
• a pin guide plate coupled to a top side of the socket body, the pin guide plate having
• first spring contact guide holes formed in a position corresponding to the first and second through holes so that the spring contacts protrude from the pin guide plate through the first spring contact guide holes,
• lower guide pins protruding from a bottom side of the in guide plate and inserted into the movement guide holes of the socket body,
• locking protrusions protruding from the bottom side of the in guide plate and engaged with the stop protrusions of the socket body, and
• upper guide pins protruding from a top side of the in guide plate;
• an IC insert body having
• an IC receiving hole formed in a central portion of the IC insert body, into which an integrated circuit (IC) is inserted from an upper side thereof and seated, and
• assembly guide holes formed around the IC receiving hole in a bottom side of the IC insert body;
• and
• a guide plate coupled to the bottom side of the IC insert body and separated from the pin guide plate, the guide plate having
• second spring contact guide holes formed in a position corresponding to the first spring contact guide holes of the pin guide plate so that the spring contacts protrude from the guide plate through the second spring contact guide holes,
• positioning guide holes into which the upper guide pins of the in guide plate are inserted, and
• assembly guide pins protruding from a top side of the guide plate and inserted into the assembly guide holes of the IC insert body.