Method for testing semiconductor dies and a test apparatus

A test apparatus for testing semiconductor dies, comprising:

• an electrically conductive carrier for receiving a semiconductor wafer, the semiconductor wafer having a plurality of semiconductor dies fabricated on the semiconductor wafer, each one of the semiconductor dies comprising a vertical transistor having a first contact element on a first upper main face of the semiconductor wafer and a second contact element on a second lower main face of the semiconductor wafer, wherein the second lower main face of the semiconductor wafer is to be connected with the electrically conductive carrier so that each one of the second contact elements of the semiconductor dies is electrically connected with the electrically conductive carrier;
• a test pin assembly comprising first test pins and second test pins, wherein the first test pins are arranged to be connected with contact elements of a semiconductor die to be tested, and the second test pins are arranged to be connected with contact elements of an auxiliary semiconductor die;
• and
• a control device connected with the test pin assembly and configured to generate first control signals and supply the first control signals to the first test pins, and to generate second control signals and supply the second control signals to the second test pins,
• wherein the first control signals are configured as electrical test signals for testing a first semiconductor die of the plurality of semiconductor dies, and the second control signals are configured to drive a second, auxiliary semiconductor die of the plurality of semiconductor dies during test measurement intervals in which the first control signals are supplied to the first semiconductor die, wherein the second control signals are further configured to establish an electrical connection between first and second electrical contact elements of the second, auxiliary semiconductor die during the test measurement intervals.