Multi-channel probe plate for semiconductor package test systems

A test system, comprising:

• probes configured to contact leads of a semiconductor package;
• a multi-channel probe plate comprising an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface, each of the electrically conductive coupling regions configured to cover a different zone of the semiconductor package when the semiconductor package is positioned in close proximity to the first main surface of the plate;
• circuitry electrically connected to each of the coupling regions of the probe plate via a different channel, the circuitry operable to measure a parameter indicative of the degree of capacitive coupling between each electrically conductive coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding electrically conductive coupling region;
• and
• a controller operable to apply test signals and ground to the semiconductor package via the probes during testing of the semiconductor package and analyze capacitance signals provided by the circuitry to determine whether an electrical connection of the semiconductor package in any of the zones of the semiconductor package or between the zones violates one or more test criteria.

A capacitive test method for semiconductor packages, the method comprising:

• positioning a semiconductor package in close proximity to a main surface of a multi-channel probe plate, the probe plate comprising an electrically insulating body and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface, each of the electrically conductive coupling regions covering a different zone of the semiconductor package;
• applying test signals and ground to the semiconductor package;
• measuring a parameter indicative of the degree of capacitive coupling between each electrically conductive coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding electrically conductive coupling region;
• and
• analyzing capacitance signals to determine whether an electrical connection of the semiconductor package in any of the zones of the semiconductor package or between the zones violates one or more test criteria.