US 9,435,691 B2Granted

Infrared sensor

AssigneeMitsubishi Materials Corporation

InventorsKenzo Nakamura, Mototaka Ishikawa, Gakuji Uozumi

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Abstract

A lightweight infrared sensor that detects a temperature at a portion spaced apart from a circuit substrate with high accuracy, is installed on the circuit substrate easily and stably, and includes an insulating film; a first and a second heat sensitive elements are disposed on one surface of the insulating film separately; a first conductive film on the insulating film that is connected to the first heat sensitive element; a second conductive film connected to the second heat sensitive element; an infrared reflection film on the other surface of the insulating film so as to face the second heat sensitive element; a plurality of terminal electrodes formed on one end of the insulating film and fitted into an external connector; an edge reinforcing plate adhered to one end of one surface of the insulating film; and a mounting hole that is formed on the other end.

Claims5

Dependent claims

An infrared sensor comprising:

an insulating film;
a first heat sensitive element and a second heat sensitive element that are disposed on one surface of the insulating film so as to be separated apart from one another;
a first conductive wiring film and a second conductive wiring film that are formed on one surface of the insulating film and are respectively connected to the first heat sensitive element and the second heat sensitive element;
an infrared reflection film that is disposed on the other surface of the insulating film so as to face the second heat sensitive element;
a plurality of terminal electrodes that are connected to the first wiring film and the second wiring film, are formed on one end of the other surface of the insulating film, and are configured to be fitted into an external connector of a circuit substrate in perpendicular to the substrate;
an edge reinforcing plate that is adhered to one end of one surface of the insulating film;
and
a mounting hole that is formed on the other end of the insulating film and configured to be fixed to an external member with facing to the substrate.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/003,728Filed 22 Mar 2012
Priority: JP 2011-07676830 Mar 2011
Published: US 2014/0010262 A19 Jan 2014
Granted: 6 Sep 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

G01J 5/05
Constructional details: means for preventing contamination of the components of the optical system; Means for preventing obstruction of the…
G01J 5/0096
Radiation pyrometry, e.g. infrared or optical thermometry: for measuring wires, electrical contacts or electronic systems
G01J 5/0205
Constructional details: mechanical elements; Supports for optical elements
G01J 5/023
Shape of the cavity itself or of elements contained in or suspended over the cavity: particular leg structure or construction or shape; Nanotubes

Family

US 2014/0010262 A1Pre-grant publication · published 9 Jan 2014
US 9,435,691 B2This patent

From the US filing history. Foreign family members aren’t listed.

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