Device and method for separating, at least partially drying and inspecting electronic components
AssigneeBesi Netherlands B.V.
InventorJurgen Hendrikus Gerhardus Huisstede
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Abstract
The invention relates to a device for separating, at least partially drying and inspecting electronic components, comprising: separating means, a carrier for the electronic components, a heating source for generating radiant heat, displacing means for displacing the carrier for the electronic components relative to the heating source, and visual inspection means. The heating source is configured to generate radiant heat in order to selectively heat and evaporate moisture present on the separated electronic components.
Claims15
A device for separating, at least partially drying and inspecting electronic components, comprising:
- a separating device for dividing a larger whole of electronic components into separated electronic components;
- a carrier for the separated electronic components;
- a heating source for generating radiant heat;
- displacing means for displacing the carrier for the separated electronic components relative to the heating source;
- and
- visual inspection means for inspecting the separated electronic components;
- wherein the heating source is configured to generate radiant heat with a wavelength in the range of 1 μm to 5 μm.
A method for separating, at least partially drying and inspecting electronic components, comprising the processing steps of:
- a) dividing a greater whole of electronic components into an assembly of separated electronic components;
- b) displacing the separated electronic components with adhering liquid lying in a plane and held by a carrier;
- c) supplying heat to the assembly of separated electronic components with adhering liquid using a heating source;
- and
- d) visually inspecting the separated electronic components dried by the heating source, wherein the assembly of electronic components with adhering liquid is irradiated by the heating source with radiant heat with a wavelength in the range of 1 μm to 5 μm.
Dependencies are inferred from the claim text.