Components with microchannel cooling

A method of forming cooling channels at a trailing edge of a component comprising a substrate having an outer surface and an inner surface, wherein the inner surface defines at least one hollow, interior space, wherein the outer surface of the substrate defines a pressure side wall and a suction side wall, wherein the pressure and suction side walls are joined together at a leading edge and at the trailing edge of the component, the method comprising:

• forming at least one substantially axially oriented groove in the outer surface of the substrate that extends along the pressure or suction side walls to the trailing edge of the component;
• forming at least one access hole in the substrate, wherein each access hole is formed through the base of a respective one of the one or more grooves, to connect the groove in fluid communication with the respective hollow interior space;
• and
• disposing a coating comprised of a superalloy over at least a portion of the outer surface of the substrate, wherein the coating comprises at least one structural coating, wherein the at least one structural coating extends over the one or more grooves, such that the one or more grooves and the at least one structural coating together define one or more channels for cooling the trailing edge of the component, and
• wherein each of the one or more channels comprises an outlet portion that intersects one of the pressure side wall or the suction side wall at the trailing edge and extends through the coating to define an outlet at the trailing edge.