Layer by layer electro chemical plating (ECP) process

A method of electro-chemical plating, comprising:

• providing a substrate having a trench into an electroplating solution comprising a plurality of ions of a material to be deposited;
• filling the trench by sequentially forming a plurality of deposited layers respectively having a uniform thickness of the material along sidewalls and a lower surface of the trench, wherein the plurality of deposited layers are formed by applying a periodic patterned signal to the substrate, which alternates between a first value and a different second value during formation of each of the plurality of deposited layers;
• dynamically varying one or more parameters of the periodic patterned signal including:
• a maximum voltage or a minimum voltage;
• and
• wherein the first value causes one or more of the plurality of ions from the electroplating solution to affix to the substrate as a deposited layer, and wherein the second value causes one or more ions to dissociate from the deposited layer, thereby reducing a thickness of the deposited layer.

A method of electro-chemical plating, comprising:

• providing a substrate having a trench into an electroplating solution comprising a plurality of ions of a metal material to be deposited;
• filling the trench by sequentially forming a plurality of deposited layers respectively having a uniform thickness of the metal material along sidewalls and a lower surface of the trench, wherein the plurality of deposited layers are formed by applying a periodic patterned signal to the substrate, which alternates between a first voltage value and a different second voltage value during formation of each of the plurality of deposited layers;
• dynamically varying one or more parameters of the periodic patterned signal including:
• a maximum voltage or a minimum voltage;
• and
• wherein the first voltage value causes one or more of the plurality of ions of the metal material to affix to the substrate as a deposited layer, and wherein the second voltage value causes one or more ions to dissociate from the deposited layer, thereby reducing a thickness of the deposited layer.