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AssigneeAtotech Deutschland GmbH
InventorsArnd Kilian, Christian Nöthlich, Dieter Metzger, Sebastian Kühne
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A method and apparatus for regenerating a plating composition which is suitable for depositing at least one first metal on a substrate where the plating rate in the plating composition is very low, where the concentration of the at least one first metal in the plating composition cannot be easily set at a constant level, and where plating-out of the at least one first metal from the plating composition takes place. The method and apparatus for regenerating a plating composition is suitable for depositing at least one first metal on a substrate at a sufficiently high plating rate, while offering the opportunity to easily adjust the concentration of the at least one first metal in the plating composition at a constant level and to provide the plating composition with sufficient stability against decomposition thereof in order to safeguard the regeneration cell from plated-out first metal.
Regeneration apparatus (300) for regenerating a plating composition which is suitable for depositing at least one first metal on a substrate (10), said regeneration apparatus (300) being especially adapted to perform a method of regenerating a plating composition which is suitable for depositing at least one first metal on a substrate (10) and which is accommodated by at least one plating device (100), said plating composition containing said at least one first metal in an ionic form and at least one second metal in an ionic form, wherein said at least one second metal may be provided in a higher and in a lower oxidation state and, when it is provided in a lower oxidation state, is capable of reducing said at least one first metal being in the ionic form to a metallic state, wherein said plating composition is accommodated by at least one plating device (100) and contains at least one first metal in an ionic form and at least one second metal in an ionic form, wherein said at least one second metal may be provided in a higher and in a lower oxidation state and, when it is provided in a lower oxidation state, is capable of reducing said at least one first metal being in the ionic form to a metallic state, said regeneration apparatus (300) comprising:
A Regeneration apparatus (300) for regenerating a plating composition which is suitable for depositing at least one first metal on a substrate (10), said regeneration apparatus (300) being especially adapted for regenerating a plating composition which is suitable for depositing at least one first metal on a substrate (10) and which is accommodated by at least one plating device (100), said plating composition containing said at least one first metal in an ionic form and at least one second metal in an ionic form, wherein said at least one second metal may be provided in a higher and in a lower oxidation state and, when it is provided in a lower oxidation state, is capable of reducing said at least one first metal being in the ionic form to a metallic state, wherein said plating composition is accommodated by at least one plating device (100) and contains at least one first metal in an ionic form and at least one second metal in an ionic form, wherein said at least one second metal may be provided in a higher and in a lower oxidation state and, when it is provided in a lower oxidation state, is capable of reducing said at least one first metal being in the ionic form to a metallic state, said regeneration apparatus (300) comprising:
Dependencies are inferred from the claim text.