US 9,435,032 B2 · Method for forming patterned conductive film

Abstract

The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C. According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.

Claims2

Dependent claims

A method for forming a patterned conductive film, the method comprising:

bringing a substrate and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C.,
wherein the substrate has a layer made of platinum microcrystal particles formed thereon in a pattern and
the platinum microcrystal particles are crystalline platinum cubes obtained by a method comprising bringing a platinum complex compound;
an acid;
a primary alcohol having 2 to 12 carbon atoms;
and
a hydrophilic polymer,
into contact with each other in a polar solvent.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/253,459Filed 15 Apr 2014 · division

Priority

JP 2010-01667428 Jan 2010

Published

US 2014/0227436 A114 Aug 2014

Granted

6 Sep 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification16 codes

C23C 18/1603
Process or apparatus: coating on selected surface areas
C23C 18/06
By thermal decomposition: coating on selected surface areas, e.g. using masks
C23C 18/08
By thermal decomposition: characterised by the deposition of metallic material
C23C 18/10
Characterised by the deposition of metallic material: deposition of aluminium only

Family

PCT/JP2011/052185Parent of this division · filed 26 Jan 2011

US 2014/0227436 A1Pre-grant publication · published 14 Aug 2014

Application13/575,477Parent of this division

US 8,828,555 B2Parent of this division

US 2012/0298402 A1Published application

US 9,435,032 B2This patent

From the US filing history. Foreign family members aren’t listed.

Method for forming patterned conductive film

Life of this patent

Method for forming patterned conductive film

Life of this patent

Abstract

Claims2