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US 9,434,865 B2Granted
Adhesive composition, an adhesive sheet and a production method of a semiconductor device
AssigneeLintec Corporation
InventorsSayaka Tsuchiyama, Isao Ichikawa
Life of this patent
Estimating the term…
Abstract
An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.
Claims9
An adhesive composition comprising:
- an acrylic polymer (A),
- a heat curable resin (B), and
- a silane coupling agent (C) having a reactive double bond group selected from the group consisting of a (meth)acryl group, a vinyl group, a styryl group, and an allyl group,
- wherein the acrylic polymer (A) is included in a ratio of 50-90 wt. % in an entire weight of the adhesive composition and a weight average molecular weight of the acrylic polymer (A) is 100,000 to 2,000,000, and
- wherein the heat curable resin (B) comprises an epoxy resin and a heat curing agent, and at least one of the epoxy resin and the heat curing agent comprises an unsaturated hydrocarbon group.
2 more elements
An adhesive composition comprising:
- an acrylic polymer (A),
- a heat curable resin (B), and
- a silane coupling agent (C) having a reactive double bond group comprising a (meth)acryl group, a vinyl group, a styryl group, or an allyl group,
- wherein the acrylic polymer (A) is included in a ratio of 50-90 wt. % in an entire weight of the adhesive composition and a weight average molecular weight of the acrylic polymer (A) is 100,000 to 2,000,000, and
- wherein the heat curable resin (B) comprises an epoxy resin and a heat curing agent, and the heat curing agent comprises an unsaturated hydrocarbon group.
2 more elements
Dependencies are inferred from the claim text.