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US 9,434,817 B2Granted
Room-temperature-curable resin composition
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsTaiki Katayama, Takafumi Sakamoto
Life of this patent
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Abstract
The invention is a room-temperature-curable resin composition including a phosphazene skeleton-containing organosilicon compound shown by the following general formula (1). This provides a room-temperature-curable resin composition which is curable in short time, free from generation of an odor due to the catalyst, free from a heavy environmental load; and has sufficient hardness, elongation at shear, and tensile strength after curing.
Claims6
A room-temperature-curable resin composition comprising a phosphazene skeleton-containing organosilicon compound shown by the following general formula (1),
- wherein, “R” represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, “R1” and “R2” may be the same or different and represent a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, “A” represents a single bond or a divalent hydrocarbon group having 1 to 6 carbon atoms, “Y” represents a hydrolysable group, and “n” is an integer satisfying 0≦n≦3.
Dependencies are inferred from the claim text.