Wafer encapsulated microelectromechanical structure

A method of fabricating a microelectromechanical device, the method comprising:

• forming a microelectromechanical structure within a first substrate, including forming a cavity within the first substrate, and forming trenches within the first substrate to separate first and second portions of the first substrate from each other and from one or more remaining portions of the first substrate, the first portion of the first substrate being disposed within the cavity and constituting the microelectromechanical structure, and the second portion of the substrate being disposed at least in part within the cavity and constituting a first portion of an electrical contact;
• and
• securing a second substrate to the first substrate over the cavity to define a chamber containing the microelectromechanical structure, the second substrate having a first portion that constitutes a second portion of the electrical contact, the first portion of the second substrate being disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber and is formed partly from each of the first and second substrates.

A microelectromechanical device comprising:

• a first substrate having a cavity formed therein and trenches to separate first and second portions of the first substrate from each other and from one or more remaining portions of the first substrate, the first portion of the first substrate being disposed within the cavity and constituting a microelectromechanical structure, and the second portion of the first substrate being disposed at least in part within the cavity and constituting a first portion of an electrical contact;
• and
• a second substrate secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure, the second substrate having a first portion that constitutes a second portion of the electrical contact, the first portion of the second substrate being disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber and is formed partly from each of the first and second substrates.