Package for metal-ceramic substrate and method for packing such substrates

A package and a plurality of stacked metal-ceramic substrates held within the package, comprising:

• the plurality of stacked metal-ceramic substrates, each of the plurality of stacked metal-ceramic substrate consisting of a ceramic layer and a plurality of single metallizations formed on at least one surface side of the ceramic layer, the plurality of stacked metal-ceramic substrates having break-off lines extending between the plurality of single metallizations;
• a tray comprising at least one holder adapted to a format of the plurality of stacked metal-ceramic substrates holding the plurality of stacked metal-ceramic substrates, wherein a depth of the at least one holder is such that the plurality of stacked ceramic metal substrates are stacked such that one of the plurality of stacked metal-ceramic substrates is positioned above another of the plurality of stacked metal-ceramic substrates, and the plurality of stacked metal-ceramic substrates fit entirely within the at least one holder, the at least one holder having an interior defined by a bottom and circumferentially by an circumferential edge, the at least one holder is provided circumferentially with corner recesses and edge areas forming the circumferential edge and the corner recesses and the edge areas merge into each other to form a U-profile that is open toward the bottom side of the tray, the U-profile being defined by a circumferential first wall section forming an outer surface of the circumferential edge, a second wall section circumferentially limiting at least one holder and forming an inner surface of the circumferential edge, and a third wall section connecting the first wall section and the second wall section in a yoke-like manner;
• and
• the tray also includes a covering completely enclosing the plurality of stacked metal-ceramic substrates located in the holder, wherein the tray is evacuated to vacuum seal the covering about the plurality of stacked metal-ceramic substrates so that the plurality of stacked metal-ceramic substrates are fixed in the at least one holder by clamping on an edge-side of the tray by forces (F) exerted on the circumferential edge resulting from ambient pressure created by the vacuum.