US 9,434,497 B2Granted

Peeling device

AssigneesHong Fu Jin Precision (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.

InventorsBing Li, Bo Yang

Life of this patent

Estimating the term…

Loading patent…

Abstract

A label peeling device includes a mounting bracket, a power member attached to the mounting bracket, a driving member driven by the power member; and a pressing assembly coupled to a first end of the driving member. A clamping mechanism includes a sliding member coupled to a second end of the driving member, and a clamping assembly configured to clamp a backing paper. A first resisting member is attached to the mounting bracket, and presses against the clamping assembly. The pressing assembly and the clamping mechanism are configured to be urged toward each other by a driving force imparted by the power member, the first resisting member drive the clamping assembly to the sliding member, and thereby cause at least one of the plurality of wafers to be removed from the backing paper.

Claims14

Dependent claims

A peeling device comprising:

a mounting bracket;
a supporting member attached to the mounting bracket and configured to support a backing paper having a plurality of wafers thereon;
a power member attached to the mounting bracket;
a driving member coupled to the mounting bracket and connected to the power member;
a pressing assembly coupled to a first end of the driving member;
a clamping mechanism comprising:
a sliding member coupled to a second end of the driving member,
a clamping assembly configured to clamp the backing paper, and
a movable member connecting the sliding member with the clamping assembly;
and
a first resisting member attached to the mounting bracket, the first resisting member configured to press against the clamping assembly;
wherein the pressing assembly and the clamping mechanism are configured to be urged toward each other by a driving force imparted by the power member, the first resisting member is configured to drive the clamping assembly to move toward the sliding member, and thereby cause at least one of the plurality of wafers to be removed from the backing paper.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/496,708Filed 25 Sep 2014
Priority: CN 2013 1 061933929 Nov 2013
Published: US 2015/0151530 A14 Jun 2015
Granted: 6 Sep 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification11 codes

B65C 9/0006
Details of labelling machines or apparatus: removing backing sheets
B32B 43/006
Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor: delaminating
B65C 2009/0009
Removing backing sheets: by means of a peeling tip
Y10T 156/1168
Methods of delaminating, per se; i.e. , separating at bonding face: gripping and pulling work apart during delaminating

Family

US 2015/0151530 A1Pre-grant publication · published 4 Jun 2015
US 9,434,497 B2This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

Citations

Open elsewhere

Building an agent or pulling many patents? Use the API or MCP server instead of scraping pages. Get an API key