Robot blade design

A robot blade for a wafer transfer robot, comprising:

• a wafer reception area configured to receive a semiconductor wafer;
• a plurality of spatially distinct contact structures, respectively comprising one or more contact points disposed at positions along a perimeter of the wafer reception area and configured to provide support to outer edges of the semiconductor wafer;
• a cavity comprising a negative relief separating two or more of the plurality of spatially distinct contact structures;
• wherein one or more of the plurality of spatially distinct contact structures comprise an angled sidewall having a constant slope, which is directly connected to both a horizontal surface and a vertical surface, and wherein one or more of the contact points are arranged along the angled sidewall;
• and
• wherein one or more of plurality of contact structures comprise a stepped structure having a first step having a horizontal surface, wherein a first contact point is located on the horizontal surface of the first step.

A robot blade for a wafer transfer robot, comprising:

• a wafer reception area arranged over an upper surface of a wafer blade and configured to receive a semiconductor wafer;
• a first contact point located along a tapered sidewall of a first contact structure, wherein the tapered sidewall is directly connected to a first horizontal surface and a vertical surface, wherein the vertical surface is further connected to a second horizontal surface arranged along a bottom of the wafer blade;
• a second contact point located on a second contact structure that protrudes outward from the first horizontal surface;
• a transfer arm connected to the wafer blade at a first connection point and configured to vary a position of the wafer blade;
• and
• wherein the second contact point is located on a third horizontal surface arranged along an upper surface of the second contact structure.