US 9,434,046 B2 · Polishing composition and polishing method using the same

Abstract

The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains a nitrogen-containing nonionic surfactant and abrasive grains and has a pH of 9 to 12. The content of the nitrogen-containing nonionic surfactant in the polishing composition is preferably 20 to 500 ppm. The abrasive grains contained in the polishing composition are preferably colloidal silica. The average primary particle diameter of the abrasive grains contained in the polishing composition is preferably 10 to 90 nm. The content of the abrasive grains in the polishing composition is preferably 1.0 to 5.0% by mass.

Claims11

Dependent claims

A method of polishing polysilicon, comprising:

preparing a polishing composition containing colloidal silica abrasive grains and a nitrogen-containing nonionic surfactant selected from the group consisting of a polyoxyethylene alkyl amino ether and a polyoxyethylene fatty acid amide, wherein the nitrogen-containing nonionic surfactant is contained in the polishing composition in an amount of 20 to 85 ppm, and wherein the polishing composition has a pH of greater than 9 to 12;
and
using the polishing composition to polish polysilicon.

Dependencies are inferred from the claim text.

Facts

Application

13/923,477Filed 21 Jun 2013 · division

Priority

JP 2008-0232271 Feb 2008

Published

US 2013/0288573 A131 Oct 2013

Granted

6 Sep 2016

Term ends

Not estimatedThe source records don’t support an estimate.

Classification6 codes

B24B 37/044
Operating processes therefor: characterised by the composition of the lapping agent
C09G 1/02
Polishing compositions: containing abrasives or grinding agents
H10P 52/403
Chemomechanical polishing [CMP]: of conductive or resistive materials
B24B
Machines, devices, or processes for grinding or polishing

Polishing composition and polishing method using the same

Life of this patent

Polishing composition and polishing method using the same

Life of this patent

Abstract

Claims11