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US 9,434,045 B2Granted
Planarization device and planarization method using the same
AssigneeMacronix International Co., Ltd.
InventorsYu-Hua Yeh, Liang-Yu Hu, Tang-Tsai Chang, Ming-Tsan Lai
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Abstract
A planarization device and a planarization method using the same are provided. The planarization device comprises a platen, a grinding pad, an operation arm, a chuck and a shielding pad. The grinding pad is disposed on the platen. The operation arm has a lower surface. The chuck rotatably is disposed on the operation arm. The shielding pad is detachably disposed on the lower surface of the operation arm.
Claims16
A planarization device, comprising:
- a platen;
- a grinding pad disposed on the platen;
- an operation arm having a lower surface;
- a chuck rotatably disposed on the operation arm;
- and
- a first shielding pad detachably disposed on the lower surface of the operation arm;
- wherein a thickness of the first shielding pad is larger than a gap between the operation arm and the chuck, and wherein the first shielding pad extends below an upper surface of the chuck.
4 more elements
Dependencies are inferred from the claim text.