High performance transient uniform cooling solution for thermal compression bonding process

A method of comprising;

• cooling a solder joint of a die by coupling a cooling solution to the die backside surface, wherein the cooling solution comprises:
• a vertical array of micro channel jets coupled to a heater surface, wherein an outlet micro channel jet is coupled with an adjacent inlet micro channel jet;
• and
• circulating a fluid through the vertical array of micro channel jets, wherein the fluid impinges onto the heater surface that is thermally coupled to the die and exits through a manifold coupled to the vertical array of micro channel jets, wherein the heater surface and the array of micro channel jets are fabricated in the same block material, wherein the heater surface comprises micro fins, and wherein a tip of the micro fins is aligned in a center position between adjacent inlet and outlet micro channel jets.

A method of uniform transient cooling in a thermal compression bonding process comprising;

• cooling the solder joint of a die during thermal compression bonding by a die backside surface by coupling a cooling solution to the die backside surface, wherein the cooling solution comprises:
• a vertical array of micro channel jets coupled to a heater surface, wherein an outlet micro channel jet is coupled with two adjacent inlet micro channel jets;
• circulating air through the array of micro channel jets, wherein the air impinges onto the heater surface that is coupled to the die and exits through a manifold coupled to the micro channel jets, wherein the heater surface and the array of micro channel jets are fabricated in the same block material;
• and
• wherein the cooling solution further comprises a cooling block, wherein inlet and outlet micro channels are disposed in a staggered configuration, and wherein a bottom portion of the cooling block is chamfered.

A method of comprising;

• cooling a solder joint of a die by coupling a cooling solution to the die backside surface, wherein the cooling solution comprises:
• a vertical array of micro channel jets coupled to a heater surface, wherein an outlet micro channel jet is coupled with an adjacent inlet micro channel jet;
• and
• circulating a fluid through the vertical array of micro channel jets , wherein the fluid impinges onto the heater surface that is thermally coupled to the die and exits through a manifold coupled to the vertical array of micro channel jets, wherein the heater surface and the array of micro channel jets are fabricated in the same block material;
• wherein the micro channels are disposed inside the heater block, and wherein a cooling block of the assembly is fabricated in the same material piece in which heater loops are embedded, wherein inlet and outlet micro channels are disposed in a staggered configuration, and wherein a bottom portion of the cooling block is chamfered.