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US 9,434,027 B2Granted
Bonding wire and method for manufacturing same
AssigneeNippon Micrometal Corporation
InventorRyo Togashi
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Abstract
It is an object of the present invention to provide a bonding wire capable of maintaining a structure and a configuration thereof at the time of performing wire bonding; and a manufacturing method thereof. Provided is a bonding wire having a core member mainly composed of copper; and a palladium coating layer. Particularly, formed in a center of the core member is a fibrous structure with copper crystals extending in an axial direction.
Claims8
A bonding wire comprising:
- a core member mainly composed of copper;
- and
- a palladium coating layer, wherein
- said core member includes a fibrous structure with copper crystals extending in an axial direction, said fibrous structure being formed in a center of said core member, and
- said core member includes a grain-shaped recrystallized region formed through a recrystallization of crystals, said grain-shaped recrystallized region being formed surrounding said fibrous structure.
2 more elements
Dependencies are inferred from the claim text.