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US 9,433,962 B2Granted
Application of fluids to substrates
AssigneeInfineon Technologies AG
InventorsKarl Pilch, Hans Leitner, Michael Kalin
Life of this patent
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Abstract
Various embodiments relate to application of a fluid to a substrate. The fluid is locally heated, for example, to obtain a desired thickness profile.
Claims11
An apparatus comprising:
- a first device comprising:
- a substrate holder;
- a glue application device configured to apply a glue to one of a semiconductor substrate or a carrier on the substrate holder;
- a heating mechanism configured to locally heat the glue;
- and
- a controller configured to control the heating mechanism to apply a local heating in order to obtain a desired thickness profile having a flatness with a predetermined tolerance of the glue on the one of the semiconductor substrate or the carrier;
- and
- a second device comprising a grinding wheel configured to grind the semiconductor substrate mounted to the carrier with the glue sandwiched between the semiconductor substrate and the carrier.
5 more elements
Dependencies are inferred from the claim text.