Recirculating dielectric fluid cooling
AssigneeIntel Corporation
InventorsShankar Krishnan, Eric D. McAfee, Tod A. Byquist
Life of this patent
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AssigneeIntel Corporation
InventorsShankar Krishnan, Eric D. McAfee, Tod A. Byquist
Estimating the term…
Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.
An apparatus for immersion cooling comprising:
A method for immersion cooling comprising:
A server system comprising:
Dependencies are inferred from the claim text.