Cooling device and cooling arrangement including cooling device
AssigneeHkr Seuffer Automotive GmbH & Co. KG
InventorWolfgang Bass
Life of this patent
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Abstract
The invention relates to a cooling device for heat-emitting components, wherein at least one component is arranged on a printed circuit board and wherein the cooling device includes a first cooling member and a second cooling member. The two cooling members are arranged on the printed circuit board adjacent to and at a predetermined distance from the at least one component on opposite sides of the component. The invention further relates to a cooling arrangement for cooling at least one heat-emitting component arranged on a printed circuit board, wherein use is made of the cooling device.
Claims10
A cooling device for heat-emitting components, wherein at least one component is arranged on a printed circuit board, comprising
- first and second cooling members,
- wherein the two cooling members are arranged on the printed circuit board adjacent to and at a predetermined distance from the at least one component on opposite sides of the component,
- wherein the cooling members include segments which are arranged in parallel to each of the respective sides of the at least one component and extend away from the printed circuit board, and
- wherein on the at least one component a cooling unit is arranged and the cooling unit includes a contact area resting on the at least one component for making thermal contact, and wherein the cooling members of the cooling device extend away from the printed circuit board at a height that exceeds a height of the at least one component adjacent to the contact area and are spaced apart from the latter.
A cooling arrangement for cooling at least one heat-emitting component arranged on a printed circuit board, comprising
- a cooling unit in the form of a casing comprising a heat sink and a cover, wherein
- in an assembled condition of the casing the printed circuit board is arranged with the at least one component between the heat sink and the cover and the heat sink includes a contact area resting on the at least one component for making a thermal contact, and in the area of the at least one component the cover has a projecting portion which contacts the printed circuit board on the side of the printed circuit board facing away from the at least one component, and
- a cooling device comprising
- first and second cooling members,
- wherein the two cooling members are arranged on the printed circuit board adjacent to and at a predetermined distance from the at least one component on opposite sides of the component.
Dependencies are inferred from the claim text.