Electronic component, method for manufacturing the same and method for manufacturing multilayer printed wiring board

A method for manufacturing an electronic component, comprising:

• forming an insulation layer comprising an optically transparent resin material and having a conductive layer patterned such that the conductive layer comprises an alignment mark and a wiring layer on a first surface of the insulation layer;
• forming an adhesive layer comprising an adhesive resin material and an optically opaque agent on a second surface of the insulation layer on an opposite side with respect to the first surface of the insulation layer;
• and
• forming an opening portion in the adhesive layer at a position corresponding to the alignment mark such that the opening portion exposes the alignment mark through the insulation layer.

A method for manufacturing a multilayer printed wiring board, comprising:

• forming a buildup layer comprising a plurality of insulation layers and a plurality of conductive layers;
• positioning an electronic component having an alignment mark to a position on a surface of the buildup layer based on the alignment mark of the electronic component;
• mounting the electronic component to the surface of the buildup layer in the position;
• and
• forming an outer insulation layer on the surface of the buildup layer such that the outer insulation layer covers the electronic component mounted on the surface of the buildup layer,
• wherein the electronic component has an insulation layer comprising an optically transparent resin material, a conductive layer formed on a first surface of the insulation layer and patterned such that the conductive layer comprises the alignment mark and a wiring layer positioned on the first surface of the insulation layer, and an adhesive layer comprising an adhesive resin material and an optically opaque agent and formed on a second surface of the insulation layer on an opposite side with respect to the first surface of the insulation layer, and the adhesive layer has an opening portion formed at a position corresponding to the alignment mark such that the opening portion exposes the alignment mark through the insulation layer.