US 9,433,076 B2Granted

Mounting structure of electronic components provided with heat sink

AssigneeNew Japan Radio Co., Ltd.

InventorsYoshio Fujii, Shinji Hara

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Abstract

There is provided a mounting structure of electronic components wherein the heat sink is disposed so as to allow a high heat releasing property to be achieved and ensure that manufacturing is easy. The resin film is provided at the lower surface side of the whole circuit element to which the lead is connected; a molding resin is molded at the upper side from the lower surface of the lead including the side portions of the lead, the circuit element and the connecting portions of the lead and the circuit element; the lead is connected to the electrode of the circuit board so that flattened back surfaces of a plurality of one side resin-molded elements are on the same horizontal plane; and a single heat sink is mounted on the back surfaces of the plurality of one side resin-molded elements.

Claims3

Dependent claims

A mounting structure of electronic components provided with a heat sink, comprising:

a plurality of electronic components, each having lead portions and a resin-molded portion and being formed such that one side surface of the respective lead portions are substantially coplanar with one side surface of the resin-molded portion, so that the one side surface of the respective lead portions and the one side surface of the resin-molded portion form a back surface of the electronic component;
an electric circuit board to which the respective lead portions of each of the plurality of electronic components are connected;
a heat sink for releasing heat generated from the plurality of electronic components;
and
a resin film disposed between the plurality of electronic components and the heat sink,
wherein each of the lead portions is connected to the electric circuit board at opposite surfaces to the one side surface thereof so that respective back surfaces of the plurality of electronic components are substantially coplanar with each other;
and
the heat sink is provided on the back surfaces of the plurality of electronic components such that a single heat sink covers at least two of the plurality of electronic components.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/618,284Filed 10 Feb 2015
Priority: JP 2014-10739723 May 2014
Published: US 2015/0342025 A126 Nov 2015
Granted: 30 Aug 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H05K 1/0203
Thermal arrangements, e.g. for cooling, heating or preventing overheating: cooling of mounted components
H05K 1/021
Cooling of mounted components: components thermally connected to metal substrates or heat-sinks by insert mounting
H10W 40/10
Arrangements for thermal protection or thermal control: arrangements for heating
H10W 70/68
Characterised by their insulating layers or insulating parts: shapes or dispositions thereof

Family

US 2015/0342025 A1Pre-grant publication · published 26 Nov 2015
US 9,433,076 B2This patent

From the US filing history. Foreign family members aren’t listed.

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