Temperature control method for substrate heat treatment apparatus, semiconductor device manufacturing method, temperature control program for substrate heat treatment apparatus, and recording medium

A computer-readable recording medium on which a temperature control program is recorded,

• wherein the temperature control program is for a substrate heat treatment apparatus that includes a conductive heating container in an evacuable treatment chamber, and subjects a substrate to a heat treatment with heat of the heating container, a filament being incorporated into the heating container, thermal electrons generated from the filament being accelerated by an accelerating voltage applied between the filament and the heating container from an accelerating power source, the heating container being heated by causing the accelerated thermal electrons to collide with the heating container, the program causing a control apparatus of the substrate heat treatment apparatus to:
• increase a treatment temperature while controlling an emission current so as to be at a fixed value;
• continue the treatment temperature increase while reducing the emission current in a stepwise manner, after the treatment temperature reaches a preset temperature, before reaching an annealing temperature;
• and
• maintain the treatment temperature at a fixed value while controlling the emission current until an annealing treatment is completed, after the treatment temperature reaches the annealing temperature.