Electronic quartz resonator module provided with shock resistant securing means

An electronic module with a quartz or MEMS resonator, said module comprising:

• the quartz or MEMS resonator confined within a resonator case, which is provided with electrical contact pads over at least one external surface of the resonator case, for the electrical connection of the resonator,
• at least one flexible printed circuit board for carrying the resonator case and including electrical connection terminals for connection to the electrical contact pads of the resonator case,
• wherein the resonator case is fixedly held in a case structure of the electronic module, sandwiched between two elements for damping mechanical shocks, and wherein the damping elements hold the resonator case and are compressed between two internal walls of the case structure of the electronic module,
• wherein the electrical contact pads of the resonator case are secured straight to the electrical connection terminals of the printed circuit board which is flexible,
• wherein the resonator case fixed to the flexible printed circuit board is fixedly held in the case structure of the electronic module sandwiched between the two damping elements, the first damping element of which is in contact with an inner surface of a base of the case structure, and the second damping element of which is in contact with an inner surface of a cover of the case structure, which is secured to the base,
• wherein the electrical connection terminals of the printed circuit board are positioned on a top surface of the printed circuit board between the top surface of the printed circuit board and a bottom surface of the resonator case,
• wherein the first damping element is in contact with a bottom surface of the circuit board opposite to the top surface of the printed circuit hoard,
• wherein the flexible printed circuit board is connected to another rigid printed circuit board carrying other electronic components, said flexible printed circuit board having a smaller thickness than the rigid printed circuit board,
• wherein the resonator case and the damping elements are disposed inside a first cavity of the case structure of the electronic module, and
• wherein the rigid printed circuit board with electronic components are disposed inside a second cavity of the case structure of the electronic module, wherein a connection portion of the flexible and rigid printed circuit boards is disposed in a passage between the two cavities of the case structure.